PART |
Description |
Maker |
XRAG2 |
Contactless Memory Chip 432 bit
|
ST Microelectronics
|
M35101 |
13.56 MHZ, ISO 14443, CONTACTLESS MEMORY CHIP 2048-BIT EEPROM
|
STMicroelectronics
|
SRT512 |
13.56 MHz short-range Contactless memory chip with 512-bit EEPROM and anticollision functions
|
STMicroelectronics
|
XRAG2 XRAG2-W4I XRAG2-SBN18I |
UHF, EPCGLOBAL CLASS-1 GENERATION-2, CONTACTLESS MEMORY CHIP 432 BIT WITH MULTI-SESSION PROTOCOL, ANTI-COLLISION AND KILL FUNCTIONS
|
意法半导 STMicroelectronics
|
SRIX512-W4/1GE |
13.56MHz Short Range Contactless Memory Chip with 512 bit EEPROM, Anti-Collision and Anti-Clone Functions
|
ST Microelectronics
|
SLE55R04 |
Contactless Secured Memory IC(非接触式存储器芯12字节EEPROM))
|
SIEMENS AG
|
BL93C46 BL75R06SM |
The BL93C46 provides 1024 bits of serial electrically erasable programmable read only memory BL75R06SM Contactless smart card chip consists of the RF-Interface
|
SHANGHAI BELLING CO., LTD.
|
AM49DL322BGT85T AM49DL322BGT85S AM49DL323BGB70T AM |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous 堆叠式多芯片封装MCP)闪存和SRAM32兆位M × 8 2米x 16位)3.0伏的CMOS只,同时 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) SPECIALTY MEMORY CIRCUIT, PBGA73
|
Spansion Inc. Advanced Micro Devices, Inc.
|
AM41DL6408G AM41DL6408G70IS AM41DL6408G70IT AM41DL |
64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 8 Mbit (1 M x 8-Bit/512 K x 16-Bit) Static RAM Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
EM4269 |
512 bit Read/Write Contactless Identification Device
|
EMMICRO[EM Microelectronic - MARIN SA]
|
EM4006F9WT7E EM4006F9WS21E EM4006F9WS7E EM4006F9WP |
13.56 MHz 64 Data bit Read Only Contactless Identification Device
|
EM Microelectronic - MARIN SA
|